Intel Corporation and Lens Technology have announced a strategic collaboration to explore the development of advanced semiconductor packaging technologies using glass substrates. The companies said ...

South Korean President Lee Jae Myung launched an AI-focused visit to Silicon Valley by announcing a "San Francisco AI ...

South Korean President Lee Jae-myung and a delegation of the country's most powerful business leaders convened with NVIDIA ...

Taiwan-based PlayNitride aims to reduce MicroLED production costs by 75% by 2030 through smaller chip designs and its ...

Trumpf said preliminary fiscal 2025/26 results showed its business stabilizing after several years of declines in orders and ...

AI infrastructure investment is reaching unprecedented levels, with estimates showing it will lift global semiconductor ...

Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The ...

Qualcomm is expanding the reach of its Snapdragon platform across Samsung Electronics' Galaxy ecosystem, with Samsung's ...

Tsu-Jae Liu, president of the National Academy of Engineering and academician of Academia Sinica, has highlighted the ...

Taiwan's semiconductor industry is expanding overseas while deepening cooperation with the US, Europe, and Asia across ...

Huaqin Technology, the world's largest consumer-electronics original design manufacturer, has again increased its stake in ...

US efforts to restrict Chinese technology from connected vehicles are expanding beyond hardware and software sourcing, as ...