In any multi-die assembly, stacking two or more active dies results in thermal stress. Heat dissipated from a lower die faces ...
China's push for semiconductor self-sufficiency has extended to networking infrastructure, with Taiwanese IC design firms ...
A new report by Startup Nation Central reveals how Israel’s semiconductor sector has become a global force in chip design, ...
TSMC is accelerating development beyond the 2nm process node while expanding mass production of CoWoS-L, SoIC, and next-gen WMCM and CoPoS technologies. The semiconductor industry is entering a ...
As artificial intelligence grows more powerful, so does its appetite for speed and energy. The quest for faster, smarter ...
Tsinghua University scientists have developed a light-driven AI chip, OFE², utilizing photonic circuits to process data at 12.5 GHz.
A new optical feature extraction engine, dubbed OFE2, reaches 12.5 GHz, enhancing AI applications in healthcare and finance with unprecedented speed and efficiency.