CHANDLER, Ariz. — Amkor Technology Inc. has expanded its series of low-profile quad flat pack (LQFP) packages for ICs requiring higher electrical performance and enhanced thermal characteristics ...

Part of the Correct-A-Chip line, a chip adapter converts a 160-pin QFP package with 0.65-mm pin-to-pin spacing into a 160-pin through-hole array. The adapater is constructed with 0.062-in.-thick glass ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...