MUNICH, Germany — As a result of working with R&D alliance partners IBM, Chartered Semiconductors and Samsung, Infineon was able Tuesday (Jan. 31) to demonstrate its first samples of logic ICs ...
Infineon Technologies has disclosed its latest milestone in semiconductor manufacturing technology, following the announcement of the world's first 300-millimeter GaN power wafer and the inauguration ...
Infineon Technologies is set to unveil a new silicon carbide (SiC) wafer fab at its plant site in Kulim, Malaysia, which aims to move from 6-inch to 8-inch production in 2025. Malaysia's Prime ...
With a thickness of only 20 µm and a diameter of 300 mm, Infineon’s silicon power wafers are the thinnest in the industry. These ultra-thin wafers are a quarter the thickness of a human hair and half ...
Modern chips are manufactured on slabs of silicon less than a millimeter thick. But semiconductor companies try to slice these silicon wafers thinner and thinner to squeeze more performance out of ...
German chipmaker Infineon has successfully developed the world’s first 300mm power gallium nitride (GaN) wafers. The company said that the breakthrough will help to boost the market for GaN-based ...
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