Micro-electro-mechanical systems have been available for years, and have been successful in selected high-volume applications. But MEMS design is not as organized as it could be. MEMS design typically ...

SpringSoft Completes OpenAccess-Compatible IC Layout Flow with Enhancements to Laker ADP Design Entry System The Laker™ Advanced Design Platform integrates the full-featured Laker schematic editor, ...

Santa Cruz, Calif. — At first glance, the Pilot Design Environment from Synopsys Inc. may sound like a resurrected EDA framework from the late 1980s. But Synopsys claims to be taking a fresh approach ...

Automotive applications, particularly those related to AI and computer vision, are a significant driver of the current semiconductor boom. Established companies are mostly thriving, it’s true, but ...

The FICS Research Institute (University of Florida) has published a new research paper titled “Secure Physical Design.” This is the first and most comprehensive research work done in this area that ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that its custom and analog/mixed-signal (AMS) IC design flow has achieved certification for Samsung ...

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...

Cadence Design Systems and United Microelectronics Corporation (UMC) have jointly announced that the US-based EDA firm's analog/mixed-signal (AMS) IC design flow has achieved certification for the ...

Integrity 3D-IC is Cadence’s next-generation multi-chip design solution, integrating silicon and package planning and implementation with system analysis and signoff to enable system-driven PPA ...

Cadence Design Systems' analog and mixed-signal (AMS) IC design flow has been certified for United Microelectronics' (UMC) 22ULP/ULL process technologies, according to the companies. This flow ...