Researchers from Penn State have demonstrated a novel method of 3D integration using 2D materials. This advancement, detailed in their recent study, addresses the growing challenge of fitting more ...

Turn your 3D printer in an automation hub.

A technology for the three-dimensional integration of processing units and memory, as reported by researchers from Tokyo Tech, has achieved the highest attainable performance in the whole world, ...

Penn State researchers demonstrated 3D integration of semiconductors at a massive scale, characterizing tens of thousands of devices using 2D transistors made with 2D semiconductors, enabling ...

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) ...

BERKELEY, Calif. & TAIPEI--(BUSINESS WIRE)--VIVERSE, the leading 3D content distribution platform, today announced a new open-source integration with Wonderland Engine, the high-performance WebXR ...

Renowned automobile manufacturers rely on 3D CAD viewer from international company The goal is not to work with reduced ...

Engineers suggest a way to fit more transistors on a chip by seamlessly implementing 3D integration with 2D materials. Moore's Law, a fundamental scaling principle for electronic devices, forecasts ...

(Nanowerk News) Moore's Law, a fundamental scaling principle for electronic devices, forecasts that the number of transistors on a chip will double every two years, ensuring more computing power — but ...